Description
Engineered to resist pump-out, outgassing and phase separation, SX-25 eliminates concerns over silicone deposition on sensitive optics and electronics. It meets the demanding thermal and reliability needs of high-speed chipsets and graphic processors while remaining halogen-free and fully RoHS and REACH compliant.
With its stay-put viscosity, SX-25 is ideal for precision application in the most complex assemblies. Experience thermal excellence with no tradeoffs in stability or safety – upgrade to our SX-25 Series for your next-generation designs.
Features:
Unmatched Heat Dissipation With the best-in-class thermal conductivity of 25.0 W/m-K, this paste rapidly draws heat away from components.
Ultra-Low BLT Achieve extremely thin bond lines for faster heat transfer away from delicate electronics.
2 year shelf life, you can count on consistent performance from each application.
Non conductive.