SIGMAOX material engineering principles
Wide Temperature Operating Ranges
Thermal compounds that work in extreme temperatures
Low Mobility
Non-Evaporative compounds with minimal pump-out due to thermal cycling
High W/m∙K Ratings
Thermal ratings on par with indium and metallic TIMS
Nonvolatile
Nonreactive for use on Land, Sea and Space
featured SIGMAOX product:
The revolutionary SX Series phase change materials achieve unmatched thermal performance through an innovative hybrid formula—free of diluents and solvents for pure efficiency. Experience industry-leading heat dissipation tuned to withstand extreme conditions in aviation, space, electronics, and photonics.
Take thermal control further with SX Series—the new performance standard redefining reliability and durability. Push past prior limitations with materials engineered without compromise.
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SX-25 Thermal Paste
$255.00
Successful thermal management of high-power electronic components (single chips, multi-chip modules, integrated circuits, etc.) with high heat dissipation ratings requires careful design engineering. The most important goal in electronic cooling is to maintain junction temperature from rising above prescribed levels, as junction temperature is a good predictor of the useful life of the component. Thermal interface materials bridge the interface between hot components and a chassis or heat sink assembly, increasing heat transfer and keeping components cooler. SigmaOx engineered formulas are designed for these applications – from satellites to silicon carbide transistors, we’re equipped with specialized solutions to high-tech problems in thermal dissipation and insulation. Our existing or customized thermal interface materials can maintain safe junction temperatures and increase lifespan across electronic systems with demanding heat output specifications.